SEC EDGAR
美光科技MU
- 报告期
- 2024-08-29
- 提交日
- 2024-10-04
- SEC 归档号
- 0000723125-24-000027
- 行业
- 半导体
Filing Summary 报告摘要
报告期 / 提交日 / 归档号 / 关键数字美国本土公司向 SEC 提交的年度报告:经审计的全年财务报表,外加业务、风险因素与管理层讨论。
- 报告期
- 2024-08-29(财年)
- 提交日
- 2024-10-04
- SEC 归档号
- 0000723125-24-000027
- 营业收入
- $251.11亿(同比 +61.6%)
- 净利润
- $7.78亿
- 经营现金流 - 资本开支
- $1.21亿
- 总资产
- $694.16亿
- 下面的财务数据是 SEC XBRL 里与这份报告「归档号 + 报告期」精确匹配的那一条,不是最新一期的替代值。
财务数据
Revenue · Profit · Cash Flow · Balance SheetRevenue 营业收入
- 营业收入
- $251.11亿
- 同比
- +61.6%
- 报告期
- 2024-08-29
- 去年同期
- $155.40亿
来源:SEC XBRL · RevenueFromContractWithCustomerExcludingAssessedTax
Profit 净利润
- 净利润
- $7.78亿
- 同比
- +113.3%
- 报告期
- 2024-08-29
- 去年同期
- $-58.33亿
来源:SEC XBRL · NetIncomeLoss
Cash Flow 现金流
- 经营活动现金流
- $85.07亿
- 投资活动现金流
- $-83.09亿
- 资本开支
- $83.86亿
- 经营现金流 - 资本开支
- $1.21亿
来源:SEC XBRL
Balance Sheet 资产负债表
- 总资产
- $694.16亿
- 总负债
- $242.85亿
- 股东权益
- $451.31亿
- 资产负债率
- 35.0%
- 净资产收益率
- 1.7%
- 时点
- 2024-08-29
来源:SEC XBRL
Important Events 重要事项
Item 编号与公告分类这份定期报告本身不含事项编号,报告期前后也没有已收录的 8-K。
Risk Factors 风险因素
节选自 SEC 原文节选自 SEC 原文的 Risk Factors 章节,未做改写。
节选自 SEC 原文 · 该章节约 150582 字,此处显示前 3000 字
Item 1A. Risk Factors.” 5 | 2024 10-K Table of Contents PART I ITEM 1. BUSINESS Overview We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence (AI) and compute-intensive applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. We manufacture our products at wholly-owned facilities and also utilize subcontractors for certain manufacturing processes. Our global network of manufacturing centers of excellence not only allows us to benefit from scale while streamlining processes and operations, but it also brings together some of the world’s brightest talent to work on the most advanced memory technology. Centers of excellence bring expertise together in one location, providing an efficient support structure for end-to-end manufacturing, with quicker cycle times, in partnership with teams such as research and development (“R&D”), product development, human resources, procurement, and supply chain. For our locations in Singapore and Taiwan, this is also a combination of bringing fabrication and back-end manufacturing together. We make significant investments to develop proprietary product and process technology, which generally increases bit density per wafer and reduces per-bit manufacturing costs of each generation of product. We continue to introduce new generations of products that offer improved performance characteristics, including higher data transfer rates, advanced packaging solutions, lower power consumption, improved read/write reliability, and increased memory density. We face intense competition in the semiconductor memory and storage markets. To remain competitive we must continuously develop and implement new products and technologies and decrease manufacturing costs in spite of inflationary pressures. Our success is largely dependent on obtaining returns on our R&D investments, efficient utilization of our manufacturing infrastructure, development and integration of advanced product and process technologies, market acceptance of our diversified portfolio of semiconductor-based memory and storage solutions, and efficient capital spending. Products, Market, and Sales Product Technologies Our product portfolio of memory and storage solutions, advanced solutions, and storage platforms is based on our high-performance semiconductor memory and storage technologies, including DRAM, NAND, and NOR. We sell our products through our business units into various markets in numerous forms, including: components, modules, SSD
数据来自 SEC EDGAR 与东方财富公开接口,仅供参考,不构成投资建议。投资有风险,决策请以交易所与公司公告原文为准。